coreless substrate
由JWang著作·2010·被引用13次—Inthispaper,thecorelesssubstratehasbeenproposedforthisstudyandhasbeenuseforflipchipBGAtoimprovetheelectricalperformance.Corelessflip ...,ETShasacorelessstructure,whichallowsfortheimplementationofmicrocircuitswithoutthe...
Warpage Issues and Assembly Challenges Using Coreless ...
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由JKim著作·被引用35次—AsshowninFigure2,corelesssubstrateisone-thirdasthinasconventionaloneandconsistsofonlybuild-uplayersandCuplateswithoutstiffcore.
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